Encapsulation Resins
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions. For Attaining IP54, IP 65 appropriate resin system and process can be chosen.
Examples: LED Driver Encapsulation for meeting IP 65, Current Transformer Potting, Automotive circuit Potting, Thermally conductive resins for special applications, Under water lighting etc
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